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| CUS01 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CUS01 Portable Equipment Battery Application Unit: mm Forward voltage: VFM = 0.37 V (max) @IF = 0.7 A Average forward current: IF (AV) = 1.0 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package "US-FLATTM" (Toshiba package name) * * * * Maximum Ratings (Ta = 25C) Characteristics Repetitive peak reverse voltage Average forward current Peak one cycle surge forward current Junction temperature Storage temperature range Symbol VRRM IF (AV) IFSM Tj Tstg Rating 30 1.0 (Note 1) 20 (50 Hz) -40 to 125 -40 to 150 Unit V A A C C JEDEC JEITA TOSHIBA 3-2B1A Note 1: TI = 86C: Rectangular waveform ( = 180), VR = 15 V Weight: 0.004 g (typ.) Electrical Characteristics (Ta = 25C) Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repetitive peak reverse current Junction capacitance IRRM (1) IRRM (2) Cj IFM = 0.1 A IFM = 0.7 A IFM = 1.0 A VRRM = 5 V VRRM = 30 V VR = 10 V, f = 1.0 MHz Device mounted on a ceramic board (soldering land: 2 mm x 2 mm) Rth (j-a) Device mounted on a glass-epoxy board (soldering land: 6 mm x 6 mm) Junction to lead of cathode side Test Condition Min Typ. 0.25 0.33 0.39 50 0.5 40 Max 0.37 1.5 75 C/W 150 30 C/W A mA pF V Unit Thermal resistance (junction to ambient) Thermal resistance (junction to lead) Rth (j-I) 1 2002-08-29 CUS01 Marking Following Indicates the Date of Manufacture Type code Lot No. 0 Month of manufacture Year of manufacture January to December are denoted by letter A to L respectively. Last decimal digit of the year of manufacture 1 2 3 4 1 5 6 7 8 9 Cathode mark Standard Soldering Pad Unit: mm 2.0 0.5 0.8 1.1 0.8 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2 2002-08-29 CUS01 iF - vF 10 0.5 PF (AV) - IF (AV) DC (A) Average forward power dissipation PF (AV) (W) iF 0.4 120 0.3 = 60 0.2 180 Instantaneous forward current Tj = 125C 1 75C 0.1 25C Rectangular waveform 0 360 Conduction angle: 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 0.01 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.0 Instantaneous forward voltage vF (V) Average forward current IF (AV) (A) Ta max - IF (AV) 140 TI max - IF (AV) 140 Maximum allowable ambient temperature Ta max (C) 120 100 80 60 40 20 0 0.0 Maximum allowable lead temperature TI max (C) Device mounted on a ceramic board (board size: 50 mm x 50 mm) 120 100 80 60 40 20 0 0.0 0 360 Conduction angle: VR = 15 V 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 = 60 Rectangular waveform IF (AV) 120 180 DC Rectangular waveform IF (AV) 0 360 Conduction angle: VR = 15 V 0.2 0.4 0.6 = 180 0.8 1.0 1.2 DC 1.4 1.6 Average forward current IF (AV) (A) Average forward current IF (AV) (A) rth (j-a) - t 10000 Transient thermal impedance rth (j-a) (C/W) 1000 (1) Device mounted on a ceramic board Soldering land: 2.0 mm x 2.0 mm (2) Device mounted on a glass-epoxy board Soldering land: 6.0 mm x 6.0 mm (3) Device mounted on a glass-epoxy board Standard Soldering pad (3) (2) (1) 100 10 1 0.001 0.01 0.1 1 10 100 1000 Time t (s) 3 2002-08-29 CUS01 Surge forward current (non-repetitive) 24 Ta = 25C f = 50 Hz 20 1000 Cj - VR (typ.) f = 1 MHz Ta = 25C Peak surge forward current IFSM (A) 12 Junction capacitance 10 100 Cj 100 16 8 4 0 1 (pF) Number of cycles 10 1 10 100 Reverse voltage VR (V) I R - Tj 100 Pulse test (typ.) 2.5 Rectangular waveform PR (AV) - VR (typ.) Average reverse power dissipation PR (AV) (W) (mA) 10 20 V 15 V 1 VR = 30 V 2.0 DC 0 360 Conduction angle: Tj = 125C 300 240 Reverse current IR 1.5 10 V 5V 3V 1.0 120 0.5 60 180 0.1 0.01 0 20 40 60 80 100 120 140 0.0 0 10 20 30 Junction temperature Tj (C) Reverse voltage VR (V) 4 2002-08-29 CUS01 RESTRICTIONS ON PRODUCT USE 000707EAA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 5 2002-08-29 |
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